Forehope Electronic (Ningbo) Co., Ltd. engages in advanced packaging field in the integrated circuit packaging and testing business. It offers bumping and wafer-level packaging, ball grid array package, quad flat no-lead and quad flat package, flip-chip, and system in package products. The company also provides design services for substrates, lead-frames, and wafer packages. Its products are used in Internet of Things, 5G, artificial intelligence, and big data applications. The company was incorporated in 2017 and is based in Yuyao, China.